Chapter 86: The Problem of Chips

Huang Haojie has already seen the construction progress of the X-ray laser base in Luhe County.

Judging from the current situation, due to the maturity of the technology, the project is expected to be completed from November to December this year.

Then adjust and preliminarily experiment for two or three months, that is to say, iron-silver superconductors at room temperature, which is expected to be mass-produced on a small scale in April next year.

Once there is a room temperature superconductor, Galaxy Technology's chips must be launched.

So this time Zhang Rujing's resignation is an opportunity for Huang Haojie.

He needs someone who knows the chip industry well to take the helm of Galaxy Technology's chip company.

And Zhang Rujing is very suitable, the other party is very good at factory construction in the chip industry, and this is exactly what Huang Haojie needs.

In addition, the other party's character is okay, Huang Haojie decided to contact the other party to see if he can pull Zhang Rujing to Galaxy Technology.

However, due to the very low completeness of the data of superconducting quantum chips, it is only about 8% so far.

Huang Haojie has decided to produce superconducting electronic chips first.

In fact, the process of superconducting quantum chips and electronic chips is much the same.

Since the second half of the 20th century, computer technology has become popular, and mankind has entered the information age.

As computer chips become more and more integrated, components become smaller and smaller, integrated circuit technology is now approaching its limit, and Moore's Law is about to fail, and the performance of electronic chips has almost reached its limit.

And despite the increasing speed of computers, there are some problems that computers simply cannot solve, such as the factorization of large numbers, which theoretically requires a large enough number to keep the fastest computers busy for hundreds of millions of years.

So the new computer has to be on the agenda.

At present, there are three main routes for future computers, namely: quantum computers, photonic computers, and biological computers.

Quantum computers are also divided into many branches, and superconducting quantum computers are currently the most promising, and other optical quanta, ion traps, superconducting circuits, diamond color centers and semiconductor quantum dots are all promising to be used to make qubits, that is, quantum computers.

Photonic computers also have great potential, of course, like quantum computers, materials are a big problem, and how to design them is also very troublesome.

As for the biological computer, this thing is also called a DNA computer or a molecular computer, which has been developed by foreigners for a long time, and the computing speed is extraordinary, but how to read the data is a huge problem.

And Huang Haojie now has room temperature superconductor technology in his hands, and he is certainly inclined to superconducting quantum computers.

In addition, the 8% of the technical data of quantum chips is not completely unusable.

He found that one of these technologies could be used in chip processing.

Let's talk about the current electronic computer chip technology, the chip production process and the level of the rice grain family (because the East Island and the mainland are now in a state of partition, the chip technology of the East Island is not equivalent to the East Tang Dynasty).

Silicon, this thing needs to be chlorinated and then distilled, and we can get very pure silicon, which is cut into slices and is the silicon we want.

The criterion of silicon is purity, and if you think about it, if there are a bunch of impurities in silicon, then the electrons don't want to run smoothly.

Solar-grade high-purity silicon requires 99.9999%, and more than half of the world's products are produced in the Eastern Tang Dynasty, and it has long been played with the price of cabbage.

The electronic-grade high-purity silicon used in the chip requires 99.9999999999% (don't count, 11 9s, also known as 11N), almost all thanks to imports

I heard that Xinhua Company in Jiangsu Province is researching and developing, and plans to initially achieve an annual output of 5,000 tons, while Dongtang imports 150,000 tons a year.

The traditional hegemon of high-purity silicon is still Hans Wacker (Wacker Chemie) and Hemlock (a joint venture between Hammerlock and Miri), and Dongtang has a long way to go.

Next is the wafer, which needs to be rotated for silicon purification, and the finished product is cylindrical. Therefore, the silicon wafer after slicing is also round, so it is called "wafer".

After cutting, thousands of circuits need to be assembled on the wafer, and this work is called "wafer factory".

So with the current human technology, how can this kind of operation be accomplished? With atomic manipulation? Maybe Huang Haojie in parallel time and space can use nanorobots to complete it, but as for now, it's better to think about it.

The process of wafer processing is a bit tedious.

First of all, a layer of photosensitive material is applied to the wafer, and the material melts when it sees light, so where does the light come from? The lithography machine can use very precise light to carve patterns on the photosensitive material, so that the wafer underneath is exposed.

Then, with something like plasma, the bare wafer will be carved out of many grooves, and this set of equipment is called an etching machine.

Phosphorus is doped into the trench to get a bunch of N-type semiconductors.

After completion, it is cleaned, re-coated with photosensitive material, engraved with a lithography machine, grooved with an etching machine, and sprinkled with boron, and the P-type semiconductor is created.

The actual process is more cumbersome, and that's how it works. It's a bit like 3D printing, where wires and other devices are packed layer by layer.

So why not make the chip a little bigger? Wouldn't that allow more circuits to be installed? Isn't the performance catching up with foreign countries?

The answer is surprisingly simple: money! A 300mm diameter wafer, 16nm process can make 100 chips, 10nm process can make 210 chips, so the price is half cheaper, in the market can hold down competitors, make money and do more research and development, the gap is so widened.

However, the Eastern Tang military chips are basically self-sufficient, because rabbits don't care about money! You can make the chip bigger.

In addition, the larger the wafer, the greater the probability of encountering impurities, so the larger the chip, the lower the yield rate. In general, the cost of large chips is much higher than that of small chips, but for military rabbits, this is not a problem.

After all, safety comes first, and it's better to spend money than to be choked by someone.

The chip yield rate depends on the overall level of the fab, but the processing accuracy completely depends on the core equipment, which is the "lithography machine" mentioned earlier.

Lithography machine, the Netherlands-ASML company (ASML) swept the world! Sorry, the yield is not high, you guys wait slowly! Whether it is Taijidian, Sanxin, or Intel, whoever buys ASML's lithography machine first will be the first to have the 7nm process. No way, it's so powerful!

Nikon and Canon of the Sun Country also make lithography machines, but their technology is far inferior to ASML.

ASML is the only manufacturer of high-end lithography machines, each priced at at least 100 million US dollars, only 12 units were produced in 2017, and 24 units are expected to be produced in 2018, which have been snatched up by TSMC Samsung Intel, and 40 units are predicted in 2019, one of which is for Huaxin International.

Since it's so important, can't we pay more?

First: Intel has 15% of ASML's shares, Taiji Power has 5%, Sanxin has 3%, and sometimes, money is not everything. Second, the Eastern Tang Dynasty has made a "Wassenaar Agreement", sensitive technology cannot be sold, and the Eastern Tang Dynasty, North Golia, Persia, and Libya are all restricted countries.

Interestingly, in 2009, Shanghai Microelectronics' 90nm lithography machine was successfully developed (core components imported), in 2010, Mi Lijia allowed 90nm equipment to be sold to Huaguo, and later Dongtang began to tackle 65nm lithography machines, and in 2015, Mi Lijia allowed 65nm equipment to be sold to Dongtang, SMIC had the opportunity to pick up a high-end machine.

Of course, the reason for this is self-evident, the reason for the relaxation of restrictions is mainly to crack down on Dongtang enterprises, so that Dongtang enterprises can not obtain profits, thus falling into a vicious circle.

But we don't have to be discouraged, we can easily kill ASML in sales with any real estate company.

The importance is second only to the etching machine of the lithography machine, the situation of Dongtang is much better, the 16nm etching machine has been mass-produced, and the 7-10nm etching machine is also on the way, so Mi Lijia is very intimate to lift the blockade of the Dongtang etching machine.

To inject boron and phosphorus and other elements on the wafer, "ion implanters" are used, and this year it seems that the first domestic commercial machine will be used in China, and the level is not known.

70% of the market share of ion implanters is owned by Mirijia Applied Materials.

To coat the photosensitive material, a "glue developer" was used, and the Tokyo Electronics Company of the Sun Country took 90% of the market share.

Even the auxiliary materials such as photoresist are almost monopolized by the Sun Country Shin-Etsu, Mi Lijia Dow, etc.

After the chip is ready, it has to be cut off from the wafer, connected to the wire, installed with the shell, and tested by the way, which is called packaging testing.

The closed test is the world of Dongdao, ranking first in the world, followed by a bunch of powerful younger brothers: Sipin, Licheng, Nanmao, Xinbang, Jingyuan Electronics.

Dongtang's three major packaging and testing giants, Changdian Technology, Huatian Technology, and Tongfu Microelectronics, are not bad, after all, they are only the end of the chip industry, and the technical content is not high.

Silicon raw materials, chip design, wafer processing, packaging and testing, and related semiconductor equipment, most of the fields of Dongtang are still in a state of "heavy responsibility and a long way to go".

So how long will this state of confusion last? According to the theory of "burning money and burning time", pinch your fingers and calculate, it will be about 2030!

The "Outline for the Development of the Integrated Circuit Industry" issued by the Dongtang Cabinet clearly states that in 2030, the main links of the integrated circuit industry chain will reach the international advanced level, a number of enterprises will enter the first echelon of the world, and the industry will achieve leapfrog development.

At present, the overall level of Dongtang chips is almost at the stage of achieving zero breakthroughs, although the market share is negligible, but every field is following up.

There is still a long way to go!