At this time, in the front row of the audience, Edward, president of Moto Gongla, looked at the parameters of the Hantang S2 mobile phone on the projection screen, and his face was very ugly.

Hantang S2 mobile phone actually has an 8 million pixel IOS optical image stabilization lens, as well as 2GB of large running memory, and the mysterious Hanfeng third-generation chip!

Among them, the most ugly thing for Edward is the Hantang voice input method and artificial intelligence Xiaomeng shown before, because these two things are not available on their motorcycle gong 911 mobile phone!

The ultra-high recognition rate of the powerful artificial intelligence Xiaomeng and the Hantang voice input method successfully defeated the direct screen manipulation method of their motorcycle.

The mobile phone operation method that allows them to write text or draw directly through the screen has become a backward product, because voice recognition is more powerful and efficient.

It can be said that just some of the information shown so far, Edward feels that this Hantang S2 mobile phone is a strong rival, and it is a strong rival that is enough to shake the Moto Gongla 911 smart phone!

Now Edward finally put away his arrogance, and instead looked at Lin Xuan on the stage with a solemn face, looking at the mobile phone in Lin Xuan's hand!

At this time, Lin Xuan looked at the surprised eyes on the scene, and he slowly said with a smile:

"Presumably, many sharp-eyed people have noticed that the artificial intelligence in the mobile phone is smarter and more responsive than the computer through the behavior of the voice input method and artificial intelligence Xiaomeng that I just used, right?"

"Huh?"

Hearing Lin Xuan's question, the people at the scene refocused their attention on the Hantang voice input method and artificial intelligence Xiaomeng.

Now hearing Lin Xuan say this, the people who witnessed all this just now also noticed that the artificial intelligence dream in the Hantang S2 mobile phone seemed to be a little smarter than the intelligent housekeeper of the computer.

And the response speed of the Hantang voice input method also seems to be faster than that of the computer, why is this?

Thinking of this, people turned their curious eyes to Lin Xuan, not knowing why the reaction speed on the mobile phone was faster than that on the computer.

"In fact, the reason for all this is very simple, the reason is located in our Hanfeng third-generation chip and the deeply customized Hantang system."

As Lin Xuan finished speaking, the picture on the projection screen behind him changed instantly, and an architecture diagram of a chip appeared in an instant.

"First of all, let's talk about the third generation of Hanfeng chips, the third generation of Hanfeng chips are different from the previous Hanfeng second generation and even Hanfeng generation chips.

It is the world's first chip with 3D chip stacking technology, and the world's first chip to integrate artificial intelligence AI algorithms into hardware! ”

"3D chip stacking technology and the integration of AI algorithms into hardware?!"

Edward's face changed.

Although he is not a technician, he realized that these two technologies are not simple through that term!

"Lin Xuan is really not simple, hahaha...... Edward, I see how arrogant you are this time. ”

At this time, in the front row of the audience, Huang Zicheng, the president of TLC mobile phone company, who was silent on his face, looked at Edward who was shocked and laughed in his heart.

"3D Chip Stacking Technology and Incorporating Artificial Intelligence Algorithms into Chip Circuits?!"

At this time, in the VIP seat in the front row, Kuke, the representative of Pingguo Company, muttered these two technologies with a solemn face.

For these two techniques, Kuke, as Jobs's right-hand man, naturally heard of the conceptual theory in this area.

Among them, the concept of 3D chip stacking technology has actually existed for a long time, but because it requires huge investment in scientific research costs to realize 3D stacking technology, and the heat dissipation of stacked chips is indeed a big problem.

This is equivalent to a chip that originally had only one layer of planar structure through 3D chip stacking technology directly into a multilayer structure.

In this way, there will definitely be a lot of heat accumulation during the operation of each layer of chips, because the heat cannot be dissipated.

Therefore, the more layers of chips in such a pile, the more heat will be accumulated, and eventually the heat of the chip will collapse and burn before it can be dissipated.

Because 3D chip stacking technology naturally has the defect of poor heat dissipation, although the concept of 3D chip stacking technology has existed for a long time, no chip company has been studying this technology until now.

After all, in the current era of wild development, the cost of semiconductor companies in various countries to promote the next generation of process technology is not high.

It has not yet reached the point where hundreds of billions of dollars will be needed to go further in the next few nanometers.

Therefore, in this era, with a huge amount of money spent on researching 3D stacking technology, it is better to develop more advanced process technology!

At this time, the Kuke heard about this 3D stacking technology from Lin Xuan's mouth, as well as the 3D stacking technology product Hanfeng third-generation chip.

That means that Hantang Technology has overcome the natural heat dissipation defects of 3D chip stacking technology and successfully conquered 3D stacking technology!

Not good news!

This means that even though the process technology of Hantang Technology is still at the 45nm level, because of the 3D chip stacking technology, Hantang Technology can stuff more transistors in the area range of the same chip!

Hantang Technology, which has mastered the 3D chip stacking technology, can plug more transistors through 3D stacking, and the actual chip manufacturing process is definitely not equivalent to 45 nanometers, but more advanced than imagined!

As for how advanced it is, it depends on how many layers of transistors they can superimpose on Hantang Technology, the more layers Hantang Technology superimposes, the more transistors there are, and the stronger the performance of the final chip.

As for the remaining concept of integrating artificial intelligence algorithms into chip design, Kuke also knows, because Pingguo is also developing this technology!

However, at present, only a special research group has been set up for this technology, and there is no good news and results.

"3D Stacking Technology and Incorporating AI Technology into Chip Design?"

When the audience heard the concept of this technology, they seemed to understand the name, but they didn't know what the technology represented.

"That's right, it's 3D chip stacking technology and the integration of artificial intelligence into chips."

Lin Xuan nodded lightly, and then continued:

"The so-called 3D chip stacking technology is to reduce the area of the chip by stacking the two-dimensional planar chips in the past in the form of three-dimensional stacking.

You can think of it as building blocks, and by pushing it up layer by layer, you can stuff more transistors into a three-dimensional structure.

On the small size of the mobile phone chip, the 3D chip stacking technology can play a more powerful role.

After all, the total area of mobile phones is so large, so small mobile devices such as mobile phones are the most suitable for 3D chip stacking technology! ”

Lin Xuan on the stage talked about this technology lightly, but at this time, people didn't know how much energy Lin Xuan spent in the cottage space to overcome this 3D chip stacking technology.

One of the most headaches is the heat dissipation problem of transistors, for this problem, to be honest, Hantang Technology has nothing to do, can only try to reduce the transfer of heat can not be completely eradicated.

(End of chapter)