It was already more than 1 o'clock in the middle of the night when I returned home, and I didn't disturb the sleeping Zhao Ting, so I sat there and re-sorted the semiconductor ideas I had thought of in the past.

Li Guocheng's plan for the semiconductor industry is to R&D-realization-R&D-realization... and keep repeating. And it is necessary to ensure that part of the funds after realization can continue to be invested in research and development.

Now it's all about investment, and the purchase of high-purity silica fume, the manufacture of vacuum furnaces, slicers and grinders is the first stage in his planning, and the next step is to consider monetization.

The Capital Radio Instrument Factory is modeled after a certain model of semiconductor radio from an island country in East Asia, using eight transistors and one diode. On September 30, 1964, it was officially listed in the capital Wangfujing Department Store at a price of 158 yuan.

Due to the insufficient purity of monocrystalline silicon, only 4~6 9, and precision is the main factor affecting the yield of transistor manufacturing, the yield of transistors has been at a low level, resulting in high costs.

The semiconductor preparation method designed by Li Guocheng adopts the rotary lifting method that was matured in later generations, and according to later generations, the purity of monocrystalline silicon obtained is as high as 99.999999%, which is commonly known as 8 9 monocrystalline silicon. At present, it should be the purest monocrystalline silicon in China, and even in the world. If necessary, it can also be purified again by means of a high-frequency furnace.

Such a high-purity single crystal rod can greatly improve the yield of the product, thereby reducing the manufacturing cost of the transistor. So selling wafers is the next big thing.

The surface oxidation of the wafer is required before sale to protect the wafer. Oxidation equipment can be modified based on a vacuum furnace and is relatively simple.

Vacuum furnaces that come as an add-on can also be sold as products and can also be cashed in. It is only necessary to remove the lifting rod and design different sizes according to the user's needs, which is estimated to be in short supply.

How to operate and how to communicate with relevant departments, that is the matter of Wu Liankui and Li Huaide.

The vacuum furnace is handed over to Wang Gong for their production, which can be used as an excessive machine tool production. But wafer production also requires a team from the laboratory.

It seems that Zhang Tou and Wang Dayong don't need Wang Gong's arrangement, so they can come directly to help produce wafers.

After these are arranged, Li Guocheng has to think about the next research work, that is, to manufacture special chips. In order to make it easy to monetize, you can consider directly manufacturing special chips for AM and FM radios.

Integrating the radio's amplification and detection (demodulation) circuitry into the chip, and then giving the radio solution, can directly replace the current tube and transistor radio.

There are two main steps to make chips: wafer processing, oxidation, lithography, etching, thin film deposition, interconnect, test, and packaging.

Wafer processing equipment is now available, and oxidation equipment is easy to modify, but the difficulty is the follow-up process.

Photolithography is subdivided into 3 processes: photoresist, exposure and development, similar to the principle of photography.

Coating photoresist: The first step in drawing a circuit on a wafer is to apply photoresist to the oxide layer. Photoresist makes the wafer "photo paper" by changing its chemical properties. The thinner the photoresist layer on the wafer surface, the more uniform the coating, and the finer the pattern that can be printed.

Exposure: Selectively passes light through an exposure device, and as light passes through a mask containing the circuit pattern, the circuit is printed onto a wafer coated with a photoresist film underneath.

A mask is a copper plate with a circuit printed on it, and light can be printed on the wafer through the engraved copper plate.

During the exposure process, the finer the printed pattern, the more components can be held in the final chip, which helps to increase production efficiency and reduce the cost per component. In this field, the new technology that has attracted much attention in the future is EUV lithography.

Development: The post-exposure step is to spray a developer on the wafer with the goal of removing the photoresist from areas not covered by the pattern, allowing the printed circuit pattern to be revealed.

Knowing the above lithography process, etching is easy to understand, that is, through a chemical reaction, the non-circuit part is washed out

Thin film deposition, which can now be doped by thermal diffusion, is a very easy process to implement.

Doping is the doping of a certain number and a certain type of impurities into silicon to obtain a precise impurity distribution shape. After a piece of monocrystalline silicon is doped with phosphorus, an N-type semiconductor is formed, and a semiconductor doped with boron atoms is a P-type semiconductor.

The thermal diffusion method is to heat diffuse the atoms of the material to be mixed into the semiconductor at a high temperature of 1000°C to form N-type semiconductors or P-type semiconductors.

The interconnection, using the aluminum wire diffusion method, can use the same equipment as the above process.

There is no good way to test at present, and it can be detected by optical naked eye.

Packaging is when all the chips are separated from the wafer and we need to attach individual chips (individual wafers) to the substrate (lead frame). The role of the substrate is to protect the semiconductor chips and allow them to exchange electrical signals with external circuits.

The electrodes of the chip are connected to the external metal pins with gold wires, sleeved like abrasives, injected with plastic solution, and the packaging process is completed after cooling.

Photoresists, developers, and etching solutions can be done by professionals. As for the lithography equipment and heat treatment equipment, it can only be designed and manufactured by Li Guocheng.

Knowing that the process of later generations is so rogue, reaching the goal directly, and not taking detours.

As long as you take the first step, you can continue to manufacture special chips, and then upgrade the process to improve the yield of chips and reduce manufacturing costs.

Now that the West is still in the exploration stage, we can manufacture relevant equipment in advance, continuously optimize the process in production, and achieve the purpose of rapid overtaking.

By doing this, Li Guocheng's first stage goal has been achieved.

The next step is to use these devices to start designing and building computers in the Uncharted Laboratory.

Computer Li Guocheng does not dare to appear in this world too much in advance for the time being, special chip research, the whole world is researching, we are a little faster There is no problem, if we study the big killer of the computer, it will not necessarily lead to any consequences.

In later generations, Huawei is the best example, and it must not show its fangs and muscles until it grows up.

All plans need to be communicated with Old Man Zhao, and the support of him and Zhao's father must be obtained.

It was already 3 o'clock in the morning, and I lay down in my clothes and soon fell asleep.

The next day, in Li Huaide's office, there were three people sitting, Li Huaide, Wu Liankui and Li Guocheng.

Li Guocheng explained yesterday's method and inventory of realization, waiting for the response of the two of them.

"Now the country is the semiconductor boom, if it is really as Xiao Li said, wafer production is promising", Li Huaide made up his mind after a little contemplation.

"Xiao Wu, you hurry up and write a report, and you and I will go to the ministry to report in the afternoon, and strive to get the approval as soon as possible."

Then he looked at Li Guocheng, "Xiao Li, you work with Wang Gong as soon as possible to produce 5 more vacuum furnaces and oxidation furnaces as soon as possible, and you must increase the output of wafers."

Looking at the backs of the two of them, Li Huaide couldn't help rubbing his temples, "This Xiao Li's movements are too fast, following the successful development of the Shuguang 1966 machine tool, the Shuguang II machine tool was soon launched. Now, it is even faster to create a hot semiconductor across fields. If it weren't for the right time, semiconductors would not dare to report it, otherwise the rolling mill would have been roasted on the fire."

Thank you all for your support! Ask for recommendations! Ask for a commuter pass!

(End of chapter)