The weather in Xiangjiang has started to cool down slowly.

At this time, it is the end of September in the Chinese solar calendar, and the traditional Chinese festival Mid-Autumn Festival has just passed.

After more than four months of hard work, the 1.2 micron chip line equipment has been installed in the newly upgraded and expanded plant of Xiangjiang Semiconductor Manufacturing Co., Ltd., and although the upgrading and transformation period of the entire production line is nearing completion, the commissioning of the production line equipment is still in full swing, and the scene is in full swing.

In the past four months, Yu Zixian has also traveled back and forth between Yueben and Xiangjiang to coordinate various instructions.

At this time, Cao Fei, deputy general manager and director of the technology R&D center (the scale of the laboratory has been upgraded), took Yu Zixian, Kashima Tomoki, and Cai Junjie's mentor Aso Shunichi and others to visit the plant and production line equipment that are about to be upgraded.

The chip manufacturing plant can be divided into 6 separate factories, each of which includes several types of wafer process-related equipment.

In this expansion of the production plant, according to the production process, the equipment specifications are issued for the process steps required in each area, and then the production line automation system is launched, equipment installation, process adjustment and integration are carried out to confirm that the yield of each product can successfully meet the requirements.

The fabrication of a collective circuit requires hundreds of steps, which are built in multiple layers in these six factories, and the wires of the MOS components and circuit design are stacked on the wafer in layers like building a house. The mass production specifications in each process, including measurement data and related process parameter settings, are the standards for procurement and acceptance of equipment, and are also part of the patents and core technologies of each major chip manufacturer, and the realization of process technology needs to be realized through purchase.

At this time, Xiangji has basically mastered the large-scale manufacturing process of 1.2 micron chips, including the core technology and patents.

Yu Zixian, who was visiting the lithography area to follow the visit, was suddenly stopped by a person wearing clean clothes, Yu Zixian fixed his eyes, but found that it was Cheng Du.

"Mr. Yu, Tong Ruoyu called from Yueben, and now he is in some trouble!"

"Trouble, what trouble?" At this time, the transformation of the production line of Xiangjidian is nearing completion, and the main work left is the final commissioning of the equipment.

Because of the help of a large number of factory technicians to jointly debug the equipment, Yu Zixian is now very confident that a yield of 30% can be achieved at the start of the production line.

In particular, ASML sent several expert-level equipment engineers to the factory for guidance, and even sent a lithography process engineer to reside in Xiangjidian, just for the normal operation of the Xiangjidian lithography plant and equipment.

Photolithography is the longest and most difficult process in the entire integrated circuit manufacturing process, accounting for about 50% of chip manufacturing and about 1/3 of the chip production cost.

Therefore, the active participation of ASML at this time is self-evident for the timely and high-yield operation of the production line of Xiangji.

Of course, ASML did not do this without purpose, after all, this past August, ASML launched the PAS5500 lithography machine, which symbolizes the beginning of its maturity. At this time PAS5500 already had industry-leading productivity and resolution, laying a solid foundation for ASML to break the market monopoly of Nikon lithography machines. The great success of the PAS 5500 seems to have been predicted.

That's right, ASML just wants to appease Yu Zixian, don't let Yu Zixian talk nonsense, and then wait for the release of the PAS 5500 new generation lithography machine series......

Of course, Yu Zixian at this time will naturally not be so uninteresting, as long as ASML does not change its face, Yu Zixian can't wait to maintain a good cooperative relationship between the two.

To Yu Zixian's delight, so far, ASML has maintained its previous enthusiasm for technical assistance, and the upgrade of the production line has been very smooth.

Therefore, at this time, Yu Zixian really couldn't understand, what bad news would Tong Ruoyu come from this side?

After Yu Zixian signaled Cao Fei to go out, he followed Cheng Du out of the factory.

After returning to the office area, Yu Zixian called back according to the phone number given by Cheng Du.

"Mr. Tong, what's wrong?"

"Boss, a new situation has just happened! Marubeni, which has been supplying us with photoresist before, suddenly notified us that the photoresist required for our new 1.2 micron process may be temporarily out of stock......

"What? Out of stock? Didn't you cooperate well before? If you actively contact again, you must confirm that it is the reason of Marubeni Kaisha or the reason of the photoresist supplier that caused the supply interruption!"

Yu Zixian couldn't understand the reason why Marubeni interrupted the supply.

Semiconductor materials are mainly used in wafer fabrication and chip packaging. Wafer manufacturing belongs to the pre-process, while chip packaging belongs to the post-chip process.

Of course, Xiangji also has a little chip packaging capacity, mainly for the construction of technology research and development center, but the packaging capacity is still very weak at that time; in this production line expansion, it also strengthened the construction of chip packaging capacity.

Due to the complexity of semiconductor manufacturing and packaging and testing technology, from wafer bare die to finished chip, hundreds of special process steps such as oxidation, sputtering, lithography, etching, ion implantation, and packaging need to be processed.

Semiconductor materials are the most subdivided industrial chain links in the semiconductor industry chain, among which wafer manufacturing materials include silicon wafers, photoresists, photoresist supporting reagents, wet electronic chemicals, electronic gases, CMP polishing materials, and targets, etc., chip packaging materials include packaging substrates, lead frames, resins, bonding wires, solder balls, and electroplating solutions, etc., and similar wet electronic chemicals contain acid, alkali and other reagents, and there are hundreds of sub-industries;

MARUBENI CORPORATION IS ONE OF THE LARGEST GENERAL TRADING COMPANIES IN THIS COMPANY. Since its establishment in 1858, it has a history of more than 140 years. Headquartered in Tokyo and Osaka, the company is one of the five largest general trading companies in Japan.

Marubeni Co., Ltd. is mainly engaged in domestic, import and export trade, international trade in commodities and technical services, and uses its functions such as investment and financing to expand its business fields, and major countries have overseas branches and investment companies.

Previously, almost all of the semiconductor materials used in the production line of Heungkang Electric were supplied by Marubeni Kaisha.

Since the establishment of diplomatic relations between China and the resumption of friendly exchanges, Marubeni has been actively engaged in trade with China.

If it's not Marubeni Kaisha, it's a manufacturer of lithography machines. If it's really the ghost of the manufacturer...... Thinking of this possibility, Yu Zixian began to have a headache.

Photoresist is the most important consumable in the photolithography process, and the quality of the photoresist has an important impact on the photolithography process. At present, there is no manufacturer in China that can produce micron-scale lithography materials.

At present, lithography machines are almost monopolized by Japan and the United States, especially at this time.

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