Chapter 329 [Explain the Patent Arrangement and Talk About Others]
Just now, a group of scholars exchanged academics, and everyone spoke freely, almost ignoring Luo Sheng.
At this time, I came back to my senses and realized that Luo Sheng is not only an entrepreneur who is proficient in business, but also has a greater hidden attribute, that is, a technical master.
Luo Sheng obviously didn't finish speaking, he stared at the modified mathematical model and continued: "Another point, since they all take the depleted layer of silicon and insert a layer of oxide layer, then why do you have to put a bunch of useless silicon underneath?" Wouldn't it be cooler to make another gate directly under the oxide layer, with a channel on both sides? ”
Everyone was stunned for a while, and after coming back to their senses, they all applauded, and Luo Sheng added: "This is not enough, since this is the case, then why do you have to bury the oxide layer in the silicon?" Wouldn't it be nice if I could get the silicon out, wrap it around the insulation like a sandwich, and put a gate on the outside? ”
A semiconductor research scholar said excitedly: "It's a genius idea, such a scheme not only greatly reduces the leakage current, but also because there is one more gate, these two gates are generally connected together, so it is equivalent to greatly increasing the insulating layer capacitance mentioned earlier, that is, greatly improving the switching performance of the transistor, I dare to make a decision, this three-gate transistor, is definitely a revolutionary progress in architecture, not only 45 nm, in 32 nm, 22 nm, 14 nanometers has great room for imagination and is another victory of Moore's Law. ”
It is worth mentioning that the evolution of process nodes in the semiconductor industry can be predicted, and Moore's Law has also come into being, that is, how many nanometers the next generation of chips will be.
For example, 130 nm, 90 nm, 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm, 7 nm (5 nm), you will find that this is a proportional series of about 0.7, and this is the reason.
However, this is just a naming convention, and there is still a gap between it and the actual size.
At this moment, the research scholars attending the meeting are very excited, but after the excitement, some have returned to reason.
One scholar said: "This is a genius design, basically I dare to judge that it is feasible without supercomputing simulation verification, but the difficulty is to realize this idea." Why? Because the erected part of the silicon, that is, the silicon used as the channel, is too thin, only less than 10 nanometers, which is not only much smaller than the minimum size of the transistor (at present), but also far smaller than the smallest size that can be engraved by the most sophisticated lithography machines at present, how to get this solution out is the real problem. ”
As soon as these words came out, the other excited researchers also calmed down.
Yes, this problem cannot be avoided, and finally it comes back to the problem of lithography machine, the most sophisticated lithography machine can not be done at present, not to mention that it is impossible for Huaguo to buy the most advanced lithography machine equipment.
At present, Huaxin International is the leader in this field, but what makes people helpless is that foreigners are already able to mass-produce chips with 32-nanometer process, while Huaxin International can not even mass-produce 65-nanometer chips now, which is still in the case of the introduction of lithography machines, and they cannot make lithography machines with 65-nanometer processes.
Luo Sheng said with a smile: "You have misunderstood, it takes a lot of process flow charts to introduce it specifically, but the basic principle is that this part of silicon is not photo-etched, but grown." It first carves out a bunch of 'shelves' with ordinary precision lithography, and then precipitates a layer of silicon, so that a thin layer of silicon grows at the edge of the shelf, and then selectively etching, removing the excess material, and the rest is these standing, ultra-thin silicon, it's as simple as that. ”
When everyone heard such a set of methods, everyone was stunned for a long time.
Completely kneeling, this IQ is too overwhelming.
Seeing that everyone was speechless, Luo Sheng couldn't help but smile and added: "In fact, this kind of three-gate and ring-gate transistor physical model can be traced back to about 2000, when Professor Hu Zhengming of Berkeley, which he first proposed, but no one has realized it so far, but this scheme can be realized." ”
Xu Zhijun said excitedly: "Sensei said other things, and then talk about other issues clearly in the patent arrangement." ”
This may be one of the few solutions that Lens Semiconductor can use to compete with the world's top semiconductor manufacturers, and it is the solution of FinFET, namely the FinFET field-effect transistor, a new cutting-edge complementary gold-oxygen semiconductor transistor.
Patents are a must.
Lens Semiconductor can be said to be the leader among domestic semiconductor companies, but it is still a younger brother compared with international manufacturers, and its weak patent background can be reflected, and there are basically no top patents that can be obtained.
Accumulated too little.
In the following days, under the leadership of Luo Sheng, whether it was Lens Semiconductor or the Cote d'Azur laboratory, the researchers and scholars went to war in an all-round way, Luo Sheng came out of the process flow diagram one after another, in order to ensure that it was foolproof, after several supercomputer verifications, and then the R&D team began to use violent methods to find many strange materials to test one by one.
Otherwise, how can it be called a violent method?
This can't be helped, except for the companies that have mastered the technology, no one in the outside world knows at all, so they can only try violently, graphene materials are very good options, and siene materials are also very good.
However, the current technical conditions cannot be prepared at all, and the cost cannot be reduced, so it is naturally not competitive at present.
If these materials can be made, it is no less than a disruptive change initiated by new materials, and the fourth industrial revolution may come ahead of schedule.
Whether it is graphene or tinene, the research and development of these new materials is part of Luo Sheng's future layout, but the rice still has to be eaten one bite at a time.
It is still the era of silicon chips, and the performance of silicon materials has not been exerted to the extreme, the current mainstream process is still in the 45nm stage, the 32nm process has not been fully rolled out, and Moore's law is still strong.
The R&D team worked hard to try and make mistakes almost every day, trying more than a dozen materials and coming up with results.
……
Science and Technology Complex Building.
In the supercomputer room on the ground floor of the building, hundreds of engineers are busy here, most of these people are from Shuguang Technology, and Luo Sheng is also present.
The focus of recent work is undoubtedly the chip design and production of the third-generation Azure mobile phone, but Luo Sheng will not bury his head in a module 24 hours a day, he has a big business, and he has to take care of the problems of the submarine data center, and almost all aspects of the core technology have his figure in it.
It is no wonder why Luo Sheng feels that there will never be enough talents, especially high-end talents.
At this time, a person in charge of Shuguang Technology came to Luo Sheng's side and said with a worried expression: "Mr. Luo, is it really feasible to do this?" ”
Because Luo Sheng overturned the solution of Sugon Technology, they were very worried, and if the computer was broken, it would be a big trouble.
Luo Sheng was staring at an LCD panel, tapped a few times on the keyboard, called up a column of data to view, and said without raising his head: "Just do what I say, you don't have to worry about the rest, I won't sue you if it's broken, this is my own damage, the contract has been signed, why are you panicking?" ”
When the other party heard him say this, he was speechless for a while, and he didn't say anything.
It can only be said that there is money and capriciousness, this is a supercomputer, not a civilian PC computer.
Okay, you said so, anyway, this is your private supercomputer, you have to do it nonsense, don't do it according to Party B's suggestion, and then the computer will be damaged by you, and Sugon Technology will not take the blame.
In a sense, if Luo Sheng breaks his supercomputer, it will be a good thing for Dawning Technology, because it will definitely have to spend more money, and Dawning Technology will definitely be able to make an extra profit.
Since Luo Sheng has said this, the technical person in charge will obediently shut up.
Okay, Party A has the final say!
"Mr. Luo, Mr. Zhang of Huaxin International came to visit, do you want to meet him?" Just as Luo Sheng was messing with his supercomputing upgrade, the housekeeper of the complex building came to him and whispered about it.
Luo Sheng nodded: "Well, I know, you receive it first, let him wait, and say that I am dealing with things." ”
Now there are more people who want to see him, so wait.
……