Forty days later, Huangkeng Reservoir Microelectronics R&D Center.

In a laboratory, Ye Hua, who was wearing a dust-free suit, skillfully touched the floating screen in front of him, and glanced at the engineer who passed by, and the other party was holding a round tin film in his hand, like a thin pie, with dozens of independent microcircuit arrays on it, which meant that it was dozens of chips, just like a flat printing process.

Of course, these dozens of chips are exactly the same, the same kind, but whether it is a CPU or other integrated circuits, it is not visible to the naked eye, it depends on its IC design.

The complete process of chip production includes: chip design, chip production, packaging production, cost testing and other major links, not to mention small links, as many as more than 2,000 process flows.

For chip manufacturing, the process is like building a house, first having a wafer as the foundation, and then superimposing chips on top of each other to produce the necessary IC chips.

Before that, there must be a design drawing first, and it is useless to have the ability to manufacture design drawings, so the role of "architect" is quite important.

The IC design in the CSAC system is not only HiSilicon, but also covers IC design, and the subsidiary Frontier Nano dominates the IC design of CPU chips, and it is the IC design of PHC, and the strongest IC design belongs to HiSilicon, which also dominates the IC design of another CPU, that is, the CPU of Huawei mobile phones.

That's right, in the future, Huawei's mobile phone chips will gradually be completely localized, and silicon wafers will no longer be used, but tin wafers.

In the IC design and production process, the major IC design manufacturers are planning, and the current international representatives are Qualcomm, Intel, the world's well-known manufacturers, all of which design their own IC chips, providing chips with different specifications and performance for downstream manufacturers to choose.

The IC design process for a single chip includes hardware description language (HDL) design, chip design debugging, chip design analysis, FPGA verification, and so on.

After IC design, it is the manufacture of chips, and according to the needs of IC design, the chip scheme design is generated, and then proofing.

Pioneer Nano provides chip raw material wafers, and this time the chip sample composition of Ye Hua's process is no longer traditional silicon, but is replaced by a steinene material, and the purification is the ultimate degree of 99 9 9 decimal places.

The thinner the tin material, the lower the cost, but the process requirements are also proportional, and Shin-Etsu Chemical's purification technology is still very powerful.

The next step is wafer coating, which is a type of photoresist from oxidation and temperature resistance.

The next step is the process process that Ye Hua is leading in the current laboratory: lithography, development, etching.

In the process of the manufacturing process, a chemical substance sensitive to ultraviolet light is used, which is also provided by Xianfeng Nano, that is, it becomes soft when it encounters ultraviolet light, and the shape of the chip is obtained by controlling the position of the shading object, and the dozens of microcircuit arrays on the surface of the "big cake" in the hands of the staff just now are.

At this moment, Ye Hua instructed the staff to apply photoresist to the tin ene wafer, and the part that encountered direct ultraviolet light began to dissolve, and after completion, the dissolved part was washed away with solvent, and the remaining part was the same shape as the shading.

The next step is to add impurities and implant ions in the wafer to produce the corresponding P and N semiconductors.

Starting from the exposed area of the tin wafer and placing it in a chemical ion mixture, the process is to change the way the mixed area conducts electricity so that each transistor can turn on, off, or carry data information. A simple chip is enough to have one layer, and the complex one layer is multi-layer, which is achieved by repeating lithography and repeating the previous process, forming a three-dimensional structure, just like building a house.

However, building a house on a tin sheet is a nanometer precision, with a scale of hundreds of millions of units, and the chip production is worthy of the name, representing the ultimate peak of today's human industrial manufacturing.

The next step is wafer testing, after the above processes, lattice grains are formed on the wafer, and the electrical characteristics of each grain are tested in the form of needle testing.

The next step is packaging, fixing the finished wafer, binding the pins, and making it into a variety of different packaging forms according to the needs, which is the reason why the core of the same chip can have different packaging forms, mainly according to the user's application habits, application scenarios, market forms and other peripheral factors.

The next step is to test the packaging, after the completion of the previous process, the chip production has been completed, this step is to test the chip, reject the defective products and packaging.

Although the entire production process of a chip has been completed here, it is not yet possible to supply it to the market, and the functional test of the chip must be carried out to gradually verify whether each function is normal, and then it can be packaged and shipped for the market.

It's easy to say, but there are as many as 2,000 processes in the chip manufacturing process, and there can be no mistakes.

And the cost of the process and equipment for the production of chips is too high, for example, ASML's lithography machine, the price of a single unit is more than 100 million US dollars, even if the entire supply chain is other links, the average small company can not afford it, or if there is a little mistake in the process, unknown prediction may lead to the failure of chip production, resulting in the loss of millions or even more huge funds.

The staff who assist Ye Hua in the laboratory are all elite talents in the high-tech field, and it is still difficult to produce high-quality chips without them.

After PHC was banned globally and the Americans banned the sale of chips on the coastline, Ye Hua set up the CSAC Club, and basically all members of the system became the upstream supplier partners of PHC, and HiSilicon Semiconductor was also listed.

In addition to providing IC chips for the parent company Huawei's mobile phones in the future, HiSilicon Semiconductor will now provide four major IC chips for PHC.

As the standard leader of 5G networks, Huawei, PHC used Huawei's 5G standard at the beginning.

Then there is the Bluetooth chip, the number of this chip is H1309, produced by HiSilicon, and there is also a power management chip H1723, which is also produced by authentic HiSilicon, in addition to these three chips, there is also the last H2482, this chip is a PHC audio management chip.

As a strategic partner of the upstream supply chain, HiSilicon Semiconductor's business can obtain a huge revenue of 80~10 billion US dollars from PHC every year, and it will become a semiconductor giant that can rank in the forefront of the world.

Other members of the CSAC system are attached to the upstream supply chain of PHC hardware to supply chips for PHC, and the supplier partners in the CSAC system are aware of how precious a core seat of CSAC is, and I am afraid that countless domestic semiconductor companies will have to enter this system in the future.

As a partner or ally of the club, the patent barriers between the members of its internal system have all been broken, such as the major upstream supply chain partners who supply PHC without royalties, which is indeed a lot less income, but the supply outside the system is not among them.

In addition, because the whole CSAC is a community of interests, it breaks through the internal barriers, which means that the product is cheaper, and compared with the chips of Europeans and Americans, it can immediately gain a huge competitive advantage in the world, one is the price advantage, and the other is the technical advantage.

Well, the rabbit immediately asked again to implement the rhythm of the cabbage price.

This is the lingering pain and tears of Europeans and Americans, because the rabbit used to grab a lot of "black history" in this area, as long as the belly black rabbit enters a field, the products in this field are immediately cabbage prices.

At one time, there was a joke, saying: When Europeans and Americans are preparing to enter a field, they must first see if there are any Chinese people playing there, and if there are or Chinese people are also planning to play, then bother, don't play with you, because you can't play, you don't make money, how can you play a price war with you.

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